Bga 162 Datasheet

Mouser offers inventory, pricing, & datasheets for IC & Component Sockets. 1 of 269 REV: 051507 Note: Some revisions of this device may incorporate deviations from published specifications known as errata. The Fine Pitch Ball Grid Array (FBGA) is a laminate substrate-based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. Batronix Professional Programmer Series Batronix I Handelsweg 16 I 24211 Preetz | Germany | www. Pinning information Table 2. You are changing the region you shop from. Ryton® PPS | Solvay. MA162A from Panasonic. 11ac router with features including dual-band wireless, Gigabit Ethernet ports for wired connections, a firewall, DHCP server, and more. LM324 Datasheet, LM324 PDF, LM324 Data sheet, LM324 manual, LM324 pdf, LM324, datenblatt, Electronics LM324, alldatasheet, free, datasheet, Datasheets, data sheet. moviNAND operation is identical to a MMC card and there-fore is a simple read and write to memory using MMC protocol v4. com is an authorized e-commerce distributor of electronic components. TMS320F2812 and TMS320C2812 179-Ball GHH MicroStar BGA (Bottom View)16. Buy Heatsink, BGA, 6. ControlLogix HART Analog I/O Modules Catalog Numbers 1756-IF8H, 1756-IF8IH, 1756-IF16H, 1756-IF16IH, 1756-OF8H, 1756-OF8IH User Manual Original Instructions. Buy Heatsink, BGA, 13. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. com REV E S FIG. 95Q, Combo Mem 8Gx8 MLC NAND eMMC + 256Mx32 Mobile LPDDR3 SDRAM 3. The signal assignment of the 208 balls is described in Figure 2 for the configuration and in Table 1 for the ball signal. It does not specify the PCB pad size. SCK-053 Datasheet - 5Ohm, 3A, NTC Thermistor - TKS, SCK053 datasheet, SCK-053 pdf, SCK-053 pinout, SCK-053 manual, SCK-053 schematic, SCK-053 equivalent. 101768MS-ATARM-09-Jul-09AT91RM9200Note:1. Parker has been working on USB Type C. Find the PDF Datasheet, Specifications and Distributor Information. Mouser is an authorized distributor for many memory chip & storage manufacturers including Alliance Memory, Adesto Technologies, Cypress Semiconductor, IDT, ISSI, Maxim, Microchip, STMicroelectronics, & more. IC Chips Ethernet ICs 8 PORT SWITCH SGMII. MCC-BGA, MCC-BGAG, MCC-BGAP, MCC-BGAD Synonyms, Trade Names "BGA STENCIL CLEANER" Identified uses Cleaning agent. Buy MT29F4G08ABBDAHC:D NW162 MICRON BGA, View the manufacturer, and stock, and datasheet pdf for the MT29F4G08ABBDAHC:D NW162 at Jotrin Electronics. eMMC Socket Provides precise connectivity between your eMMC Box Hardware and eMMC IC's allows you to read and write eMMC Chips with Chip-off method. RO3003™ Laminates. 84F with extended same day shipping times. Image shown is a representation only. The CPU is the ARM926EJ-S core with MMU, DSP extensions, Jazelle Java accelerator, and 8 kB of instruction cache and 4 kB of data cache in a Harvard architecture. TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs) Data Manual PRODUCTION DATA information is current as of publication date. 6 V power supply - -40 °C to 85/105/125 °C temperature range - 200 nA in VBAT mode: supply for RTC and 32x32-bit backup registers - 8 nA Shutdown mode (5 wakeup pins) - 28 nA Standby mode (5 wakeup pins) - 280 nA Standby mode with RTC. Expert Maker Of IC Test Socket For 16 Years. Features, Applications: FAST CMOS 16-BIT IDT54/74FCT162511AT/CT REGISTERED/LATCHED TRANSCEIVER WITH PARITY. MX 8M Platforms. AMD A6-9220. 2ns 25 C 80 C 0. NET+50 Data Sheet T he Digi NET+50 is a high-performance, highly integrated, 32-bit, system-on-a-chip ASIC, designed for use in intelligent networked devices and Internet appliances. Decoupling capacitors are mounted on the printed circuit board for each DDR3 SDRAM. 1-(a) Typical small signal performance, S21,S12 FIG. Mouser offers inventory, pricing, & datasheets for IC & Component Sockets. Mouser offers inventory, pricing, & datasheets for Multichip Packages. An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. The signal assignment of the 208 balls is described in Figure 2 for the configuration and in Table 1 for the ball signal. There was a critical dimension that was 1mm off. Thin boards are recommended to minimize the parasitic. Xilinx, Inc. We offer finest suppliers for 16236, 16236995, 16237 you can also download the datasheet for 16236, 16236995, 16237. DS21455/DS21458. Pinning information Table 2. , which introduced it on November 10, 1997. 1mm blade Soldering Iron Tip for use with the MX series soldering and rework with MX-H1-AV and MX-RM3E handpieces for conduction rework of surface mount components. Parker has been working on USB Type C. 5 W high linearity silicon amplifier 2. This module is a 204-pin small outline dual in line memory module and is intended for mounting into a connector socket. FM6BD2G1GCA-1. PCI1221 GHK/PDV PC CARD CONTROLLERS SCPS042 – JULY 1998 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 description The TI PCI1221 is a high-performance PCI-to-PC Card controller that supports two independent card sockets. Apply to BGA 162 and BGA 186. FBGA is a package that is widely used in space constrained applications such as mobile and handheld computing devices. You are changing the region you shop from. Get quote, technical information and datasheet. Soldering Iron Tips. Xilinx, Inc. pin configuration for 176-ball bga package pin at91m55800a pin at91m55800a pin at91m55800a pin at91m55800a a1 ncs1 c1 a0/nlb e1 a4 g1 a12 a2 nwait c2 ncs0 e2 a3 g2 a9 a3 nrst c3 vddio e3 a5 g3 a8 a4 ntrst c4 vddcore e4 gnd g4 gnd a5 pb18/bms c5 tms e5 - g5 - a6 nwdovf c6 vddio e6 - g6 - a7 pb16 c7 mck0 e7 - g7 - a8 pb12 c8 pb13 e8. Thus, this system has only slightly larger external dimensions than the BGA device, and thus takes much less space on your PC board to complete. Used in decorative paints and varnishes. MCC-BGA, MCC-BGAG, MCC-BGAP, MCC-BGAD Synonyms, Trade Names "BGA STENCIL CLEANER" Identified uses Cleaning agent. com Batronix LEADING PROGRAMMING AND MEASUREMENT SOLUTIONS The Batronix Professional Programmer Series offers an excep-tionally flexible, simple to use and fast set of programmers that support a broad range of chips. EC70A/EC70B-SU Compact Fanless Industrial Computer. Mouser offers inventory, pricing, & datasheets for BGA. datasheet search, datasheets, Datasheet search site for Electronic Components. S162 datasheet, S162 pdf, S162 data sheet, datasheet, data sheet, pdf. Just like a U disk! Easy operation by just inserting the USB into PC. PGA / BGA / PLCC PGA BGA PLCC GRID 2. 5"HDD for higher shock resistance. About Cookies on this site: This site uses cookies to improve your online experience. I found a pic in the forums and google images but it only has 4 of the 6 wires i need. Description The AT91M55800A is a member of the Atmel AT91 16/32-bit microcontroller family, which is based on the ARM7TDMI processor core. 1 of 269 REV: 051507 Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Micron ® ®Memory Support for NXP i. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ball Grid Array (BGA) Packaging 14 14. Buy IS43DR32801A-5BBLI DRAM DDR2 SDRAM 1. 11n Wireless Router is an affordable multi-purpose router that can act as a standard SOHO (Small Office/Home Office) router or operate in two other network modes: Bridge or Router mode. 1mm blade Soldering Iron Tip for use with the MX series soldering and rework with MX-H1-AV and MX-RM3E handpieces for conduction rework of surface mount components. MMC-EMC210, is an Embedded Flash Drive (EFD) designed for industrial applications such as embedded system, vehicle entertainment system, GPS, games, email, office, etc. 35V power supply and is backward compatible with MT41J family. com Product Specification 2 VIN and VTS (3) I/O input voltage or voltage. ST10F280 7/186 2 - BALL DATA The ST10F280 package is a PBGA of 23 x 23 x 1. Feedback 5. BGA Glider Data Sheets. 4K/W, 14 x 14 x 10mm, Adhesive Foil, Conductive Foil ICK BGA 14x14x10. 11n wireless products. BGA162/BGA186 programming adatapter is an easy use toolto connect chip and PC. The NET+50 is based on the standard architecture in the NET+ARM™ family of devices. IC & Component Sockets are available at Mouser Electronics. 8GB, 1 x SATA HDD/SSD, Gigabit LAN, WLAN, 40W, compare, review, comparison, specifications, price, brochure, catalog, product information, content syndication, product info, product data, datasheet. The 71V67903 3. An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. Limiting values [1] Tsp is the temperature at the solder point of ground lead, pin 2. 3ms Ifsm 1cyc 8. The airRouter also offers multiple wireless modes including Station. Try some kit or any random PCB which uses a BGA, take some cheap working gadget, take the chip out, put it back in, starting with that kind of things I guess makes more sense than a tablet. 0) June 24, 2009 Xilinx is disclosing this user guide, manual, release note, and/ or specification (the "Documentation") to you solely for use in the development. Items in your current Cart will not be transferred. 84F with extended same day shipping times. View and Download INTEL 2ND GENERATION CORE PROCESSOR FAMILY MOBILE - DATASHEET VOLUME 1 01-2011 datasheet online. The Datasheet Archive. BGA162/BGA186 programming adatapter is an easy use toolto connect chip and PC. ・Ball Grid Array SMT Package(VZ-pkg) ・Impedance Matched Zin/Zout = 50Ω Edition 1. Its advantages over other high leadcount (greater than ~208 leads) packages are many. EB-162 Standard Service Retractable Injection Quill 3/4” Valve x 3/8” Tube with Integrated Check Valve SPECIFICATIONS SAFETY RATING 150 PSI CHECK VALVE INTEGRATED SPRING LOADED BALL CHECK VALVE SAF-T-SEAL TIP OPTIONAL QUICK DISCONNECT N/A VALVE/PROCESS CONNECTION SIZE 3/4” MNPT INLET CONNECTION SIZE 1/2” NPT SOLUTION TUBE SIZE 3/8. Selling leads from all over the world, Seekic is the world's biggest IC trading marketplace on the internet. 1mm blade Soldering Iron Tip for use with the MX series soldering and rework with MX-H1-AV and MX-RM3E handpieces for conduction rework of surface mount components. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Please check the price and availability on our website: www. Having no leads to bend, the PBGA has greatly reduced coplanarity problems. eMMC Socket is final product of long years of research and development and engineered for the best experience with best performance. Please check the price and availability on our website: www. PRODUCTION DATA. 3256-ball BGA Package OutlineFigure 4-2 shows the orientation of the 256-ball LFBGA package. AUCHIPS is the distributor of MT29TZZZ8D5JKEZB-107 W. Huawei S5320-EI Datasheet Issue 1. is an American technology company and is primarily a supplier of programable logic devices. pin configuration for 176-ball bga package pin at91m55800a pin at91m55800a pin at91m55800a pin at91m55800a a1 ncs1 c1 a0/nlb e1 a4 g1 a12 a2 nwait c2 ncs0 e2 a3 g2 a9 a3 nrst c3 vddio e3 a5 g3 a8 a4 ntrst c4 vddcore e4 gnd g4 gnd a5 pb18/bms c5 tms e5 - g5 - a6 nwdovf c6 vddio e6 - g6 - a7 pb16 c7 mck0 e7 - g7 - a8 pb12 c8 pb13 e8. 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One-stop aviation information - includes airport location, runway information, radio navigation aids, communication frequencies, nearby hotels, maps, aircraft registration database, airport photo and airplane photo gallery. emmc bga 162 datasheet, cross reference, circuit and application notes in pdf format. Free Next Day Delivery. Datasheet (data sheet) search for integrated circuits (ic), semiconductors and other electronic components such as resistors, capacitors, transistors and diodes. EB-162 Standard Service Retractable Injection Quill 3/4” Valve x 3/8” Tube with Integrated Check Valve SPECIFICATIONS SAFETY RATING 150 PSI CHECK VALVE INTEGRATED SPRING LOADED BALL CHECK VALVE SAF-T-SEAL TIP OPTIONAL QUICK DISCONNECT N/A VALVE/PROCESS CONNECTION SIZE 3/4” MNPT INLET CONNECTION SIZE 1/2” NPT SOLUTION TUBE SIZE 3/8. The PowerPC 7xx is a family of third generation 32-bit PowerPC microprocessors designed and manufactured by IBM and Motorola (now Freescale Semiconductor). Used in decorative paints and varnishes. 25*IR n=20pcs AVE : 10. Count on the fastest, most realistic experiences, brought to life by real-time ray tracing and AI. moviNAND operation is identical to a MMC card and there-fore is a simple read and write to memory using MMC protocol v4. ISL5416KI Inventory, Pricing, Datasheets from Authorized Distributors at ECIA. Different connector options (Ball Grid Array (BGA), Border Pads (BP) and Connectors) provides solutions for all possible requirements. 5K/W, 14 x 14 x 10mm, Adhesive Foil BGA STD 015 or other Heatsinks online from RS for next day delivery on your order plus great service and a great price from the largest electronics components. BGA are available at Mouser Electronics. 84F with extended same day shipping times. Mobile Processor. MO-043 : Dual In Line Package 19. FM6BD2G1GCA-1. AGB75LC04-QU-E AGB75LC04-BG-E Data Sheet Highly Integrated Amulet GEM Graphical OS Chip TM for Color Graphical User Interfaces Introduction: Amulet's new GUI processor for color displays enables OEMs and design firms to take their products to the next level by implementing interactive color-rich GUIs designed in dynamic HTML. Limiting values [1] Tsp is the temperature at the solder point of ground lead, pin 2. We offer a range of BGA packages including the FBGA. 35V power supply and is backward compatible with MT41J family. Order Now! RF/IF and RFID ship same day. This processor has a high-perfor-mance 32-bit RISC architecture with a high-density 16-bit instruction set and very low. dimensions section on page 25 of this data sheet. Count on the fastest, most realistic experiences, brought to life by real-time ray tracing and AI. Try some kit or any random PCB which uses a BGA, take some cheap working gadget, take the chip out, put it back in, starting with that kind of things I guess makes more sense than a tablet. Multichip Packages are available at Mouser Electronics. This family is called the PowerPC G3 by its well-known customer Apple Inc. RF550 can be precisely dispensed onto specific areas that require. The Celeron is a family of microprocessors from Intel targeted at the low-end consumer market. Your one-stop source for over 1 million interconnect, passive, and electromechanical products from over 250 world-class brands. those offered by Totech and others. 0 KLMxGxxEHx Draft INTRODUCTION The SAMSUNG moviNAND is an embedded MMC solution designed in a BGA package form. 00 mm • Machine Vision (1) For all available packages, see the orderable addendum at • Video Conferencing the end of the datasheet. Free Next Day Delivery. RO3003™ Laminates. eMCP socket with USB Interface BGA 162 BGA 186 Open Top Structure size 11 5x13mm Pitch 0 5mm programmer socket,for data. 1 of 269 REV: 051507 Note: Some revisions of this device may incorporate deviations from published specifications known as errata. combines power supply, RAM and FLASH into a module as small as a chip package. 6 V power supply – -40 °C to 85/105/125 °C temperature range – 200 nA in VBAT mode: supply for RTC and 32x32-bit backup registers – 8 nA Shutdown mode (5 wakeup pins) – 28 nA Standby mode (5 wakeup pins) – 280 nA Standby mode with RTC. Instant results for XC7A100T-2FGG484. Small BGA package sizes and low power consumption make eMMC a viable, low-cost memory solution for mobile and other space-constrained products. 0) June 24, 2009 Xilinx is disclosing this user guide, manual, release note, and/ or specification (the "Documentation") to you solely for use in the development. Multichip Packages are available at Mouser Electronics. 4K/W, 14 x 14 x 10mm, Adhesive Foil, Conductive Foil ICK BGA 14x14x10 or other Heatsinks online from RS for next day delivery on your order plus great service and a great price from the largest electronics components. 2ND GENERATION INTEL CORE PROCESSOR FAMILY MOBILE - DATASHEET VOLUME 1 01-2011 Computer Hardware pdf manual download. • Gesture Recognition 4 General System Diagram 1. 9309-SC Product Data Sheet See-Cure 9309-SC Light-Cure BGA, CSP Reinforcement Adhesive. Datasheet (data sheet) search for integrated circuits (ic), semiconductors and other electronic components such as resistors, capacitors, transistors and diodes. Offer BCM56025B0KPBG BROADCO from Kynix Semiconductor Hong Kong Limited. com 3-Nov-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Bal. Datasheet -production data Features • Ultra-low-power with FlexPowerControl – 1. AD220032D 2Gb LPDDR2 AD6 2Gb LPDDR2. 16236, 16236995, 16237 datasheet. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. Synolac® 60 WD 70 exhibits very good drying, durability and good color retention. 84F with extended same day shipping times. We offer finest suppliers for 16236, 16236995, 16237 you can also download the datasheet for 16236, 16236995, 16237. 1), and DSP instructions • Memories • Up to 1 Mbyte of Flash memory. Cypress Semiconductor S25FL064L Series NOR Flash are available at Mouser Electronics. 1 SSD1306 1 GENERAL DESCRIPTION SSD1306 is a single-chip CMOS OLED/PLED driver with controller for organic / polymer light emitting. Just like a U disk! Easy operation by just ins. 5 W high linearity silicon amplifier 2. УВАЖАЕМИ КЛИЕНТИ, В МОМЕНТА ФИРМАТА ИЗВЪРШВА САМО ОНЛАЙН ПРОДАЖБИ. EC70A/EC70B-SU Compact Fanless Industrial Computer. NET+50 Data Sheet T he Digi NET+50 is a high-performance, highly integrated, 32-bit, system-on-a-chip ASIC, designed for use in intelligent networked devices and Internet appliances. 1) January 30, 2015 www. 60 GHz), 1 x SO-DIMM max. This processor has a high-perfor-mance 32-bit RISC architecture with a high-density 16-bit instruction set and very low. IS25LP128F IS25WP128F Integrated Silicon Solution, Inc. Request Xilinx Corp. 1 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. com 3-Nov-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Bal. Check out the first one. Mouser offers inventory, pricing, & datasheets for Cypress Semiconductor S25FL064L Series NOR Flash. moviNAND operation is identical to a MMC card and there-fore is a simple read and write to memory using MMC protocol v4. 8ns Ta=25,80 C IF=0. Please check the price and availability on our website: www. SDRAM - DDR3 BGA-96 DRAM are available at Mouser Electronics. RO3003™ Laminates. You are changing the region you shop from. electronics distributor stock part numbers from H9DA4GH2GJAM-CR4EM to HA-123, letter h , list 1. Shaded cells define the pins powered by VDDIOM. • Available in a 176-lead LQFP (Green) or 176-ball BGA Package (RoHS-compliant) 1. 17 - 2 © Diodes Incorporated 3 of 5 www. com or modifications due to changes in technical specifications. Synolac® 60 WD 70 by Arkema is a long oil oxidizing alkyd. pin configuration for 176-ball bga package pin at91m55800a pin at91m55800a pin at91m55800a pin at91m55800a a1 ncs1 c1 a0/nlb e1 a4 g1 a12 a2 nwait c2 ncs0 e2 a3 g2 a9 a3 nrst c3 vddio e3 a5 g3 a8 a4 ntrst c4 vddcore e4 gnd g4 gnd a5 pb18/bms c5 tms e5 – g5 – a6 nwdovf c6 vddio e6 – g6 – a7 pb16 c7 mck0 e7 – g7 – a8 pb12 c8 pb13 e8. BGATRAY, QFNTRAY, QTRAY, TQTRAY, LQTRAY, TTRAY, T2TRAY, PLCCTRAY, BGA Tray. The Fine Pitch Ball Grid Array (FBGA) is a laminate substrate-based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. All of the contents specified herein are subject to change without notice due to technical improvements, etc. 2GB, 4GB, 8GB, 16GB, 32GB, 64GB: e·MMC 153-Ball Signal Assignments. For your security, you are about to be logged out. XC7A100T-2FGG484 Inventory, Pricing, Datasheets from Authorized Distributors at ECIA. View and Download INTEL P4000 - DATASHEET REV 001 datasheet online. JEDEC matrix IC trays for BGA, QFN, QFP, TQFP, LQFP, TSOP, PLCC. S162 datasheet, S162 pdf, S162 data sheet, datasheet, data sheet, pdf. Same day shipping for even the smallest of orders, on a huge range of technology products from Newark element14. The acronyms and abbreviations used in this datasheet are listed alphabetically in the table below: Table 0-1 Acronyms and abbreviations Acronym/Abbreviation Definition 2D/3D 2 Dimensional/3 Dimensional AC Alternating Current ADC Analog-to-Digital Converter ATA AT Attachment AV or A/V Audio Visual BGA Ball Grid Array BPP Bits per Pixel. Synolac® 60 WD 70 exhibits very good drying, durability and good color retention. NET+50 Data Sheet T he Digi NET+50 is a high-performance, highly integrated, 32-bit, system-on-a-chip ASIC, designed for use in intelligent networked devices and Internet appliances. P4000 - DATASHEET REV 001 Computer Hardware pdf manual download. This module is a 204-pin small outline dual in line memory module and is intended for mounting into a connector socket. home reference library technical articles manufacturing and process equipment appendix 1: test well 1 data sheet Well Logging and Formation Evaluation Covering all aspects of well logging and formation evaluation, this comprehensive guide offers practical techniques that will be valuable to petrophysicists and engineers in their day-to-day jobs. Moving Forward Faster PXA3xx (88AP3xx) Processor Family Electrical, Mechanical, and Thermal Functional Specification. HAKKO confidently introduces soldering irons and related equipment with world class quality from the latest electronics to hobbies and crafts, starting with the new products designed in Blue & Yellow. 3ms 0 5 10 15 20 25 30 AVE : 7. 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Product Folder Order Now Technical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,. Quad LC Optical Adapter, 106123-0300 datasheet, 106123-0300 circuit, 106123-0300 data sheet : MOLEX, alldatasheet, datasheet, Datasheet search site for Electronic Components and Semiconductors, integrated circuits, diodes, triacs, and other semiconductors. Maxim Integrated Products 1 Some revisions of this device may incorporate deviations from published specifications known as errata. Memory Chips are in stock and ship same-day at Mouser Electronics from industry leading manufacturers. This family is called the PowerPC G3 by its well-known customer Apple Inc. HAKKO confidently introduces soldering irons and related equipment with world class quality from the latest electronics to hobbies and crafts, starting with the new products designed in Blue & Yellow. Ball Grid Array (BGA) Packaging 14 14. "Switch-A-Pitch" BGA Fan Out Adaptors: Switch-A-Pitch Adapters from Aries Electronics Enable Use of Smaller Pitch Devices with More Cost-effective, Larger Pitch Boards : These innovative adapters can reduce high density interconnect (HDI) construction by adapting smaller pitch devices to larger footprints. Product Folder Order Now Technical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,. eMMC Reader test socket with SD Interface eMMC Reader test socket 11. 2ND GENERATION INTEL CORE PROCESSOR FAMILY MOBILE - DATASHEET VOLUME 1 01-2011 Computer Hardware pdf manual download. eMCP socket with USB Interface BGA 162 BGA 186 Open Top Structure size 11 5x13mm Pitch 0 5mm programmer socket,for data. 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